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The Effects of Weight on Comfort of Virtual Reality Devices

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Advances in Ergonomics in Design (AHFE 2018)

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 777))

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Abstract

With the development of technology, the virtual reality (VR) headsets are widely accepted and used for leisure activities and training. However, research about the comfort of the VR headsets was rarely done. The study investigated the relationships between weight of VR headsets and subjective discomfort and pressure load on the head. One-way within-subject ANOVA was conducted to test statistical differences of subjective discomfort scores and pressure loads against weight. In all three types of VR headsets, the overall subjective discomfort and pressure loads are increasing with weight. Generally, the lower weight made users feel better when wearing VR devices. Meanwhile, the integrated head-wear headset felt more comfortable than the soft belts headset as a whole. Some suggestions about improving comfort of VR device is presented.

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Acknowledgments

This research was support by the crucial technology exploration and application on ceramic 3D printing based on digital innovation design program and HW next generation virtual reality device study program through Hunan University.

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Authors and Affiliations

  1. School of Design, Hunan University, Changsha, 414000, China

    Yan Yan, Ke Chen, Yu Xie, Yiming Song & Yonghong Liu

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  1. Yan Yan
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  2. Ke Chen
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  3. Yu Xie
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  4. Yiming Song
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  5. Yonghong Liu
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Corresponding author

Correspondence to Yan Yan .

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Editors and Affiliations

  1. Urban Planning and Design and Ergonomics Laboratory, Faculdade de Motricidade Humana, Universidade de Lisboa, Research Centre in Architecture, Lisbon, Portugal

    Francisco Rebelo

  2. School of Design, Hunan University, Changsha, China

    Marcelo M. Soares

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Yan, Y., Chen, K., Xie, Y., Song, Y., Liu, Y. (2019). The Effects of Weight on Comfort of Virtual Reality Devices. In: Rebelo, F., Soares, M. (eds) Advances in Ergonomics in Design. AHFE 2018. Advances in Intelligent Systems and Computing, vol 777. Springer, Cham. https://doi.org/10.1007/978-3-319-94706-8_27

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  • DOI: https://doi.org/10.1007/978-3-319-94706-8_27

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-94705-1

  • Online ISBN: 978-3-319-94706-8

  • eBook Packages: EngineeringEngineering (R0)

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