TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder

ISSN: 0361-5235 (Print) 1543-186X (Online)

In this topical collection (20 articles)

  1. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature

    Chuantong Chen, Chanyang Choe, Dongjin Kim… Pages 687-698

  2. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Localized Multi-axis Loading Impact on Interconnect Thermal Cycling Performance in Via-in-Pad Plated Over (VIPPO) Board Configuration

    Mohamed Sheikh, Andy Hsiao, Weidong Xie, Steven Perng… Pages 699-709

  3. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties

    S. F. N. Muhd Amli, M. A. A. Mohd Salleh, M. I. I. Ramli… Pages 710-722

  4. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Impact of Cryogenic Temperature Environment on Single Solder Joint Mechanical Shear Stability

    Ande Kitamura, Timothy Matthews, Ruben Contreras… Pages 723-734

  5. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Whisker Growth in Sn Coatings: A Review of Current Status and Future Prospects

    Piyush Jagtap, Praveen Kumar Pages 735-766

  6. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Role of Grain Boundary Sliding in Structural Integrity of Cu-Filled Through Si Via During Isothermal Annealing

    Dipali Sonawane, Praveen Kumar Pages 767-778

  7. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Conductive and Transparent Properties of ZnO/Cu/ZnO Sandwich Structure

    Wei-Hao Chen, Chia-Yueh Chou, Bao-Jhen Li, Ching-Yu Yeh… Pages 779-785

  8. TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Time-Lapse Imaging of Ag3Sn Thermal Coarsening in Sn-3Ag-0.5Cu Solder Joints

    J. W. Xian, S. A. Belyakov, C. M. Gourlay Pages 786-795
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  9. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Effect of Different Soldering Temperatures on the Solder Joints of Flip-Chip LED Chips

    Xinmeng Zhai, Chengyu Guan, Yuefeng Li, Jun Zou… Pages 796-807

  10. TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    On the 3-D Shape of Interlaced Regions in Sn-3Ag-0.5Cu Solder Balls

    A. A. Daszki, C. M. Gourlay Pages 808-817
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  11. TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures

    V. Vuorinen, H. Dong, G. Ross, J. Hotchkiss, J. Kaaos… Pages 818-824
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  12. TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony

    S. A. Belyakov, R. J. Coyle, B. Arfaei, J. W. Xian… Pages 825-841
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  13. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Tin Whisker Growth on Electronic Assemblies Soldered with Bi-Containing, Pb-Free Alloys

    André M. Delhaise, Zohreh Bagheri, Stephan Meschter… Pages 842-854

  14. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength

    S. F. N. Muhd Amli, M. A. A. Mohd Salleh, M. I. I. Ramli… Pages 855-868

  15. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints

    Zhai Xinmeng, Li Yuefeng, Zou Jun, Shi Mingming… Pages 869-880

  16. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Effect of Ni, Zn, Au, Sb and In on the Suppression of the Cu3Sn Phase in Sn-10 wt.%Cu Alloys

    Syeda U. Mehreen, Kazuhiro Nogita, Stuart D. McDonald… Pages 881-892

  17. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Effect of Trace Addition of In on Sn-Cu Solder Joint Microstructure Under Electromigration

    Marion Branch Kelly, Aravindha Antoniswamy, Ravi Mahajan… Pages 893-902

  18. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples

    Yu-Chun Li, Ching-Hsun Chang, Alberto S. Pasana… Pages 903-913

  19. No Access

    TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Electrical and Microstructural Reliability of Pressureless Silver-Sintered Joints on Silicon Carbide Power Modules Under Thermal Cycling and High-Temperature Storage

    Won Sik Hong, Mi Song Kim, Kyoung-Kook Hong Pages 914-925

  20. TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

    The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures

    Tianhong Gu, Christopher M. Gourlay, T. Ben Britton Pages 926-938
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