Scratch formation and its mechanism in chemical mechanical planarization (CMP) Tae-Young KwonManivannan RamachandranJin-Goo Park Review Article Open access 14 November 2013 Pages: 279 - 305
Chemical mechanical polishing: Theory and experiment Dewen ZhaoXinchun Lu Review Article Open access 12 December 2013 Pages: 306 - 326
Y2O3 nanosheets as slurry abrasives for chemical-mechanical planarization of copper Xingliang HeYunyun ChenHong Liang Research Article Open access 20 July 2013 Pages: 327 - 332
Towards a unified classification of wear Michael Varenberg Research Article Open access 14 November 2013 Pages: 333 - 340
Mechanical and tribological properties of epoxy matrix composites modified with microencapsulated mixture of wax lubricant and multi-walled carbon nanotubes Nay Win KhunHe ZhangErjia Liu Research Article Open access 14 November 2013 Pages: 341 - 349
Hydrophobic, mechanical, and tribological properties of fluorine incorporated hydrogenated fullerene-like carbon films Li QiangBin ZhangJunyan Zhang Research Article Open access 23 November 2013 Pages: 350 - 358
Abrasive-free polishing of hard disk substrate with H2O2-C4H10O2-Na2S2O5 slurry Weitao ZhangHong Lei Research Article Open access 23 November 2013 Pages: 359 - 366
Erratum to: Green tribology: Fundamentals and future development Si-wei Zhang Erratum Open access 12 December 2013 Pages: 367 - 367