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Creep at Extremely Low Temperatures

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Encyclopedia of Continuum Mechanics

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Synonyms

Creep in the proximity of absolute zero; Cryogenic temperatures; Low thermal energy; Weakly excited lattice

Definitions

Evolution of scientific instruments based on the principle of superconductivity promoted in the past decades development of materials suitable for application at extremely low temperatures. Metals and alloys characterized by the face-centered-cubic lattice are massively used in cryogenic applications within the whole range of temperatures, from absolute zero to room temperature. Many of these materials demonstrate excellent physical and mechanical properties, including ductility. Depending on the material, four distinct phenomena may occur at extremely low temperatures: discontinuous (intermittent) plastic flow (DPF), plastic strain induced transformation from the parent fcc (face-centered-cubic) phase to the secondary bcc (body-centered-cubic) phase (PhT), evolution of micro-damage (μD), as well as low temperature creep (LTC). After sufficiently long loading...

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Authors and Affiliations

  1. Institute of Applied Mechanics, Faculty of Mechanical Engineering, Cracow University of Technology (CUT), Cracow, Poland

    Błażej Skoczeń

Authors
  1. Błażej Skoczeń
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Correspondence to Błażej Skoczeń .

Editor information

Editors and Affiliations

  1. Institut für Mechanik, Otto-von-Guericke-Universität Institut für Mechanik, Magdeburg, Germany

    Holm Altenbach

  2. Griffith University (Gold Coast Campus), Griffith School of Engineering Griffith University (Gold Coast Campus), Southport, Queensland, Australia

    Andreas Öchsner

Section Editor information

  1. Faculty of Mechanical Engineering, Institute of Applied Mechanics, Cracow University of Technology, Cracow, Poland

    Błażej Skoczeń

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Skoczeń, B. (2018). Creep at Extremely Low Temperatures. In: Altenbach, H., Öchsner, A. (eds) Encyclopedia of Continuum Mechanics. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-53605-6_159-1

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  • DOI: https://doi.org/10.1007/978-3-662-53605-6_159-1

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-662-53605-6

  • Online ISBN: 978-3-662-53605-6

  • eBook Packages: Springer Reference EngineeringReference Module Computer Science and Engineering

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